Vertical Integrated Capabilities
Sensor Manufacturing
At our inhouse semi-conductor production facility, we leverage many years of experience to develop and produce high quality miniature sensors. We perform the lithography and chemical vapor deposition ourselves, as well as the diffusion and annealing furnaces. After testing the wafers, they are diced and picked by well-trained special operators.
Our portfolio contains various dimensions of ISFET pH sensors and Wheatstone full bridge pressure sensors. And more sensors will follow.
Product Development
Sentron can do the whole process: starting with semiconductor processing to documentation required for the MDR. Any part in between is possible, depending on the expertise and preferences of the customer.
At the start of the partnership, we will discuss what processes the customer would like Sentron to do. The sensor assemblies that are delivered so far vary between the bare sensor die and the sensor assembly in which the sensor is integrated in a housing including a GUI. OEM pressure sensor modules typically consist of assemblies containing the pressure sensor, housing parts and control electronics. OEM pH sensor component includes the same, plus a custom reference electrode.
During the prototyping phase the sensor module design can be rapidly adapted and concepts can be tested. After the engineering project has been finalized, Sentron offers standardized volume assembly of the sensor assemblies. The sensor component is subsequently assembled into the end product by the customers.
Sensor Integration
Thanks to specific know-how of die attaching, wire bonding, encapsulating, steering and compensating the sensor, we can provide successful R&D engineering services for any sensor integration into your product. This contract development and manufacturing of sensor assemblies is feasible for any shape or dimension and for any kind of product and application.
Processes required for the pH prototypes include the placement of our pH ISFET sensor at the PCB after which it will be wire bonded, glob-topped and encapsulated. The reference electrode has to be designed such that it fits into the assembly. A diaphragm is placed in the reference chamber wall and the chamber will be gel filled. For the pressure sensor prototypes the outline is similar, although this sensor does not require the reference electrode.
The design of the electronics that is required for the steering of the sensor is included, as well as the custom-made housing for the assembly. Finally, a cable is attached, if required.
Extensive Facilities
We have all the necessary equipment in place at our Leek facility including the semi-conductor production and testing factory, a fully equipped tooling shop (including a 5-axel CNC milling machine), an electronic and PCB circuit design facility, a software development unit and a fully equipped sensor and product assembly facility.
We have a clean room facility for development, manufacturing, product testing, and qualification services of sensors, assemblies and meters. These are necessary for the determination of physical and chemical values measured in the engineering field.
Certifications
We are ISO 13485:2016 certified and have the required REACH and RoHS compliance declarations. See Ctact
